IPC-9850 - Revision A : 2011

1 INTRODUCTION

1.1 Scope

This standard establishes the procedures to characterize the capability of surface mount assembly equipment in specification documents, as well as in documentation used to verify a specific machine’s placement capability and conformance to the specification while maintaining placement accuracy to placement throughput relationship.

1.2 Purpose

IPC-9850 has been developed to standardize the parameters, measurement procedures, and the methodologies used for the specification, evaluation, and continuing verification of assembly equipment throughput and accuracy characterization parameters. These standardized tools shall be used to develop and report the information called out in this standard.

1.3 Background

Historically, placement equipment machine suppliers have selected their own parameters and methodologies to present the specification of their machines’ throughput and accuracy capabilities. The many representations of the information have made the comparisons between placement machines very difficult.

This standard simplifies the evaluation process by coupling placement throughput and placement accuracy because they are dependent on each other. This standard also specifies the methodologies by which these parameters are measured. The methodologies specified herein are consistent and verifiable, thus providing common ground methodologies between users and machine suppliers. The test boards used in this standard are for metrology reasons less complex than real-life boards so individual users will experience different levels of derate depending on their products. It is recommended for evaluation purposes that the user treats the IPC-9850 throughput rating as an initial comparison knowing that further evaluation based on actual product would be advised.