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ASTM F3139 : 15(2023)

Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry

Standard Details

1.1 This test method covers procedures for the analysis of tin-based solder alloys for minor and trace elements using inductively-coupled plasma atomic emission spectrometry (ICP-AES) instrumentation.

1.2 These test procedures were validated for the analytes and mass fractions listed below.

Element

Validated Mass Fraction
Range, mg/kg

Lead

115 to 965

Cadmium

25 to 60

Mercury

5 to 530

Antimony

85 to 1330

Bismuth

80 to 210

Arsenic

95 to 360

Silver

4000 to 42100

Cobalt

0.5 to 60

Iron

15 to 115

Chromium

0.5 to 1.5

Copper

3000 to 30600

Indium

25 to 115

Nickel

5 to 150

Phosphorus

10 to 110

Selenium

1 to 30

Zinc

2 to 160

Aluminum

1 to 3

1.3 The procedures appear in the following order:

Procedure

Section

Internal Standardization

8

Calibration Solution Preparations

9

Preparation of Sample and Validation Solutions

10

Calibration

11

Analysis Procedure

12

1.4 The values stated in SI units are to be regarded as the standard. Any other values are for information only.

1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.

1.6 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

General Information

Status : ACTIVE
Standard Type: Main
Document No: ASTM F3139 : 15(2023)
Document Year: 2015
Pages: 8
  • Section Volume:
  • 10.04 Volume 10.04 Electronics; Declarable Substances in Materials; 3D Imaging Systems; Additive Manufacturing Technologies

Life Cycle

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ASTM F3139 : 15(2023)
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