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Status : Active
Standard Type : Main
Document No : ISO 9455-14:2017
Document Year : 2017
Pages : 4
Edition : 2
Section Volume : Soldering materials (ISO/TC 44/SC 12.)
ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.