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BS IEC 62047-38:2021

Semiconductor devices. Micro-electromechanical devices - Test method for adhesion strength of metal powder paste in MEMS interconnection

General Information

Status : Definitive
Standard Type: Main
Document No: BS IEC 62047-38:2021
Document Year: 2021
Pages: 16
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)

Life Cycle

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Definitive
BS IEC 62047-38:2021
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