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Standard Type : Main
Document No : IPC-2228 : 2022
Document Year : 2022
Pages : 36
1 SCOPE
This standard establishes the specific requirements for the design of rigid, flexible and rigid-flexible printed boards utilizing radio frequency (RF) and/or Microwave circuity and/or high frequency laminates where RF transmission lines and related passive metal layers are considered as distributed circuits, instead of conventional lumped circuit elements. This standard is used to support product typically requiring materials meeting the requirements of IPC-4103 and fabricated to the requirements of IPC-6018.
1.1 Purpose
The requirements contained herein are intended to establish specific design details that shall be used in conjunction with IPC-2221 to produce designs intended to mount and attach components. The components may be through-hole, surface mount, fine pitch, ultra-fine pitch, array mounting or unpackaged bare die.