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IEC 60191-6-8:2001 (EN-FR)

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Standard Details

IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60191-6-8:2001 (EN-FR)
Document Year: 2001
Pages: 22
Edition: 1.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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IEC 60191-6-8:2001 (EN-FR)
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