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Status : Active
Standard Type : Main
Document No : ISO 4825-1:2023
Document Year : 2023
Pages : 12
Edition : 1
Section Volume : Fine ceramics (ISO/TC 206.)
This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.