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SAE SSB1_002 : 2014

Environmental Tests and Associated Failure Mechanisms

Standard Details

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications.This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.

Cross Reference: EIA J-STD-020,EIA JESD-22-A113,EIA659,IPC/JEDEC J-STD-033

General Information

Status : Stabilized
Standard Type: Main
Document No: SAE SSB1_002 : 2014
Document Year: 2014
Pages: 13

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SAE SSB1_002 : 2014
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