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IEC 60191-6-2:2001/COR1:2002

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

General Information

Status : ACTIVE
Standard Type: Corrigendum
Document No: IEC 60191-6-2:2001/COR1:2002
Document Year: 2002
Edition: 1.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

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IEC 60191-6-2:2001/COR1:2002
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