BSB Edge
IEC 63011-3 : 2018
Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via

Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via

Document No. IEC 63011-3 Document Year 2018
Format unit price price in USD
PDF Version CHF   70.00 USD  70.98   Add to Wishlist
Print Version CHF   70.00 USD  70.98   Add to Wishlist

Standard Details

IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document. 

BSB Trackedge


Get Notified

When your standard gets updated