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IEC 62769-101-1:2023 (EN-FR)

Field device Integration (FDI)® - Part 101-1: Profiles - Foundation Fieldbus H1

Standard Details

IEC 62769-101-1:2023 is available as IEC 62769-101-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 62769-101-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784‑1_CP 1/1 (Foundation™ Fieldbus H1)[2].

[1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

[2] Foundation™ Fieldbus is the trade name of the non-profit consortium Fieldbus Foundation. This information is given for the convenience of users of this standard and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 62769-101-1:2023 (EN-FR)
Document Year: 2023
Pages: 64
Edition: 3.0
  • Section Volume:
  • TC 65.SC 65E Devices and integration in enterprise systems

Life Cycle

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IEC 62769-101-1:2023 (EN-FR)
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